17th International Conference on VLSI (VLSI 2026)
\nNovember 27 ~ 28, 2026, Zurich, Switzerland
\nhttps:\/\/dppr2026.org\/vlsi\/index<\/p>\n
Scope & Topics<\/p>\n
17th International Conference on VLSI (VLSI 2026) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of VLSI. Original, unpublished papers, describing research in the general area of VLSI are solicited. Both theoretical and experimental research results are welcome in the following areas, but are not limited to. The conference focuses on all technical and practical aspects of high performance computing, green computing, pervasive computing, cloud computing etc.<\/p>\n
Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the areas of Computer Science, Engineering and Applications.<\/p>\n
Topics of interest include, but are not limited to, the following:<\/p>\n
\u2022 VLSI Design
\n\u2022 Analog, Digital and Mixed Signal ICs
\n\u2022 RF, mmWave and THz Circuits
\n\u2022 Low Power and Energy Efficient Design
\n\u2022 High Performance and HPC Circuits
\n\u2022 Analog AI and In Sensor Computing
\n\u2022 Compute in Pixel Architectures
\n\u2022 Computer Aided Design (CAD)
\n\u2022 AI Driven Physical Design
\n\u2022 Autonomous EDA Agents
\n\u2022 Generative EDA Models
\n\u2022 EDA Foundation Models
\n\u2022 AI Driven Analog Layout Automation
\n\u2022 Lithography Aware Design
\n\u2022 High NA EUV Co Design
\n\u2022 Testing and Testability
\n\u2022 Reliability, Aging and Variability
\n\u2022 AI Accelerator Reliability
\n\u2022 Fault Tolerance and Resilient Architectures
\n\u2022 Post Silicon Validation
\n\u2022 AI Driven Yield Optimization
\n\u2022 Hardware Security and Trusted Computing
\n\u2022 Side Channel and Fault Injection Resistance
\n\u2022 AI Enhanced Side Channel Analysis
\n\u2022 ML Driven Hardware Attacks
\n\u2022 Secure SoCs, Crypto Accelerators and PUFs
\n\u2022 Chiplet Supply Chain Security
\n\u2022 Emerging Technologies
\n\u2022 Carbon Nanotube, Graphene and 2D Materials
\n\u2022 Spintronics, TFETs and Novel Transistors
\n\u2022 Quantum and Cryogenic CMOS
\n\u2022 Cryo CMOS for Quantum Control
\n\u2022 Superconducting Logic and SFQ Circuits
\n\u2022 Photonic and Optoelectronic Circuits
\n\u2022 Photonic AI Accelerators
\n\u2022 Optical Neural Networks
\n\u2022 Chiplet Based Architectures
\n\u2022 3D IC and TSV Integration
\n\u2022 Monolithic 3D Integration
\n\u2022 Microfluidic and Liquid Cooled 3D ICs
\n\u2022 Thermal Mechanical Co Design
\n\u2022 Backside Power Delivery Networks
\n\u2022 RISC V Hardware and SoCs
\n\u2022 Wafer Scale AI Systems
\n\u2022 AI\/ML Hardware Accelerators
\n\u2022 Hardware for LLMs and Foundation Models
\n\u2022 Memory Centric LLM Accelerators
\n\u2022 Sparse and Low Precision AI Hardware
\n\u2022 Emerging Memory Technologies
\n\u2022 In Memory Computing
\n\u2022 AI Optimized Memory Hierarchies
\n\u2022 Near Memory AI Processing
\n\u2022 LLM Centric Memory Subsystems
\n\u2022 High Bandwidth Interconnects and NoCs
\n\u2022 VLSI for Communications and 6G
\n\u2022 VLSI for Video, Imaging and Vision
\n\u2022 VLSI for Security and Cryptography
\n\u2022 VLSI for Sensor Networks and IoT
\n\u2022 Biomedical and Wearable VLSI
\n\u2022 Green Semiconductor Manufacturing
\n\u2022 Carbon Neutral Chip Design
\n\u2022 Energy Efficient Packaging<\/p>\n
Paper Submission
\nAuthors are invited to submit papers through the conference Submission System by September 26, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).<\/p>\n
Selected papers from VLSI 2026, after further revisions, will be published in the special issues of the following journals<\/p>\n
\u2022 International Journal of VLSI Design & Communication Systems (VLSICS)
\n\u2022 Signal & Image Processing : An International Journal (SIPIJ)
\n\u2022 International Journal of Embedded Systems and Applications (IJESA)
\n\u2022 International Journal of Computer Science & Information Technology (IJCSIT) – INSPEC Indexed
\n\u2022 Information Technology in Industry (ITII)<\/p>\n
Important Dates
\n\u2022 Submission Deadline: September 26, 2026
\n\u2022 Authors Notification: October 24, 2026
\n\u2022 Registration & Camera-Ready Paper Due: October 31, 2026<\/p>\n
Contact Us
\nHere’s where you can reach us: vlsi@dppr2026.org<\/p>\n
<\/p>\n
This event is not affiliated with Invest Ottawa and is independently organized by a third party.<\/em><\/p>\n","protected":false},"parent":0,"template":"","class_list":["post-140139","event","type-event","status-publish","hentry","event-category-other-events"],"acf":[],"yoast_head":"\n